On November 19, the unveiling ceremony of the National Third Generation Semiconductor Technology Innovation Center (Hunan) was launched in Changsha, Hunan Province, and Chen Fei, Vice Governor of Hunan Province, unveiled it. On the same day, several co construction units of the Center signed the Agreement on Co construction of Guochuang Hunan Center, which is intended to closely follow the major national strategies and regional scientific and technological needs, focus on common technologies and major bottlenecks, break through core technologies, and support the third generation semiconductor industry to move towards the middle and high-end.
It is understood that Guochuang Center (Hunan) focuses on the cutting-edge technologies and key industrial technologies of the third generation semiconductor equipment, focusing on the major needs of the third generation semiconductor devices, taking the third generation semiconductor core equipment as a breakthrough, breaking through the key core technologies, building a technology research and development and industrialization incubation platform, creating a high-level talent team, innovative systems and operating mechanisms, Build a collaborative innovation ecology of the third generation semiconductor with Hunan's advantages and characteristics and an industrial ecology of the whole industry. At the same time, the province focuses on the layout of the National Innovation Center in Hunan, building a domestic first-class third generation semiconductor equipment technology innovation platform, creating a third generation semiconductor equipment independent innovation highland, building a third generation semiconductor equipment achievements transformation and industry incubation platform, and realizing the third generation semiconductor industry cluster with equipment as its characteristics.
According to the plan, by 2025, the National Innovation Center (Hunan) will drive the annual output value of Hunan's third-generation semiconductor industry to 10 billion yuan, and establish and improve the complete standard system for the design, manufacturing and verification of domestic equipment. By 2030, it is planned to drive the annual output value of Hunan's third-generation semiconductor industry to 100 billion yuan, and realize the positive equipment design, the independent core technology, the integration of equipment and process, and the intelligent manufacturing process.